Method and device for mounting electronic component

ABSTRACT

In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle  11  and that of the picked-up component  12  is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette  3  from which the component  12  has been fed is in abnormal condition, as well as the mounting action of the component  12  is stopped.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a component mounting method anddevice which are used in a component mounting apparatus for mounting anelectronic component on an electrode in a process of mounting operationin which a paste of cream solder is applied on an electrode on a circuitboard, on which an electronic component which is positioned above theelectrode is mounted, after which the cream solder is heated and meltedto join the component onto the electrode.

[0003] 2. Description of the Related Art

[0004]FIG. 4 is a plan view typically showing a primary structure of acomponent mounting device, in which a plurality of parts cassettes 42 ina component feeding unit 43, respectively accommodating different typesof electronic components, are moved to a position where the component ispicked up by a suction nozzle unit 41 in the order of mounting onto thecircuit substrate 44.

[0005] The suction nozzle unit 41 has a rotary structure, which isconstructed such that a plurality of suction nozzles 40 mounted thereonare successively moved on a circular track for picking up an electroniccomponent from the parts cassette 42 in the component feeding unit 43and mounting it onto the circuit substrate 44 which has been loaded to amounting position. The suction nozzle unit 41 rotates to successivelytransfer each of the suction nozzles 40 from the positions denoted atencircled numerals 1 to 10 in a clockwise direction as shown in thefigure. The electronic component is picked up from the parts cassette 42at a component pick-up position (component pick-up point) denoted atencircled numeral 5, the picked-up posture of the component isrecognized with image recognition process using a camera at a posturerecognizing position (component recognizing point) denoted at encirclednumeral 7, and the posture of the component is corrected around the axisof the suction nozzle 40 by its rotation based on the recognitionresults of the picked-up posture of the component at a posturecorrecting position (component position adjusting point) denoted atencircled numeral 9.

[0006] Meanwhile, the circuit substrate 44 is supported on an X-Y table(not shown) for free movements in X- and Y-directions, so as to bring apredetermined position of the circuit substrate 44 on which anelectronic component is to be mounted is brought under a componentmounting position (component mounting point) denoted at encirclednumeral 10 of the suction nozzle unit 41. The circuit substrate 44 isalso moved in directions for correcting displacement of the component inX- and Y- directions based on the picked-up posture recognition results.It is thus possible to mount an electronic component 45 picked up by thesuction nozzle 40 which is displaced as shown in FIG. 5 precisely on thepredetermined position on the circuit substrate 44.

[0007] However, in high density chip mounting of recent years, the spacebetween two adjacent components have become smaller and smaller. As aresult, especially in the case where the outer dimensions of thecomponent are smaller than those of the suction nozzle, and under acondition that the center of the suction nozzle and that of thecomponent are not in register with each other, it is often the case thatthe suction nozzle and an electronic component which has previouslymounted on the circuit board interfere with each other, thus causingmounting errors. As shown in FIG. 6, for example, when mounting theelectronic component 45 picked up by the suction nozzle 40 next to theelectronic component 46 which has already been mounted on the circuitsubstrate 44, if the electronic component 45 held with the suctionnozzle 40 is displaced from a prescribed position of the nozzle, thesuction nozzle 40 which is lowered so as to mount the electroniccomponent 45 to a predetermined position will hit the electroniccomponent 46 previously mounted, which may cause the component 46 to betilted or sprung out.

[0008] Also, the electronic component mounting device has an automaticrecovery function in the case of failing to mount a component due toerrors in picking up action, which is implemented such that thecomponent which the nozzle failed to mount is mounted after all theother components have been mounted. In such a case, since the mountingorder is different from the normal one, the component has to be mountedbetween the other components which have already been mounted, whereforeif the position of the component held by the suction nozzle isdisplaced, it is more often the case that the suction nozzle and thepreviously mounted component interfere with each other, causing frequenterrors in mounting operation of the components onto the circuitsubstrate 44. In particular, it may cause a serious problem if theheight of the component which has already been mounted is larger thanthat of the component which is going to be mounted later.

SUMMARY OF THE INVENTION

[0009] In view of the foregoing, an object of the present invention isto provide a component mounting device and method, by which, whenmounting components onto a circuit substrate, the quality of mountedconditions of the components is kept favorable without causing anyinterference between the previously mounted component and the nozzle,even when the center of the nozzle and that of the component are notcorrespondent to each other.

[0010] In order to achieve the above object, the component mountingdevice of the present invention comprises a means for measuring anamount of displacement between a center position of a component suctionnozzle and a center position of the component held by the componentsuction nozzle with respect to each of the components fed from all partscassettes set in a component feeding unit during the component mountingdevice is in operation, informing that a particular parts cassette fromwhich the component has been fed is in abnormal condition when theamount of displacement is larger than a predetermined value, and forstopping the action of mounting the component.

[0011] With this arrangement, under a certain abnormal circumstancewhile the device is in operation, it is informed to an operator thatabnormality has been occurred as well as the mounting action is stopped,thereby preventing interference between the component suction nozzle andthe component, and enabling the operator to investigate and confirm thecauses of the abnormality.

[0012] Further, the device comprises a means which measures an amount ofdisplacement between a center position of a component suction nozzle anda center position of a component held by the component suction nozzle,and detects and informs that a particular component suction nozzle orparts cassette from which the component has been fed is in abnormalcondition based on resultant data of measurement, wherein the componentis respectively picked up by the component suction nozzle from all ofthe parts cassettes set in a component feeding unit and measurement ofthe displacement amount of the component is effected in a preparatorystep before commencement of actual production.

[0013] By this means, defective nozzles or parts cassettes areidentified prior to actual production, by which mounting errors whenmounting the component onto the circuit substrate can be avoided.

[0014] Also, in order to achieve the above object, the componentmounting method of the present invention comprises the steps of:measuring an amount of displacement of the component with respect to thecomponent suction nozzle; and adjusting the component pick-up positionof the parts cassette which requires position adjustment based onresultant data of measurement.

[0015] More specifically, the method comprises the steps of: obtainingdata on an amount of displacement of the component from a prescribedholding position of the component suction nozzle corresponding to eachof the parts cassettes based on posture recognition results detected atthe posture recognizing position; and adjusting a feeding position ofthe electronic component to the component pick-up position based on thisdisplacement amount data.

[0016] According to the above described component mounting method, fromthe data on the posture of the component held by the component suctionnozzle with respect to all the electronic components detected at theposture recognizing position, the data on displacement amount of thecomponent per each parts cassettes can be obtained, wherefore thetendency of displacement in the component feeding position with respectto the pick-up position of the suction nozzle can be recognized.Specifically, if it is found that all of the electronic components aredisplaced in the same direction, it is determined that the position ofthe component feeding unit or the parts cassettes in its entirety isinappropriate in relation to the component pick-up position, whereas ifit is found that only a specific type of electronic components arealways picked up in a displaced position, it is determined that thefeeding position of the parts cassette which feeds this type ofelectronic component is inappropriate. Accordingly, by adjusting thecomponent feeding position to the component pick-up position in adirection for correcting displacement based on the displacement tendencyobtained from displacement data, it is possible to pick up the componentprecisely in a predetermined position of the component suction nozzle,whereby it is possible to mount electronic components accurately on thecircuit substrate with high mounting density.

[0017] If it is detected from the displacement amount data that all ofthe electronic components are picked up in a displaced position in thesame direction, such displacement can be corrected by adjusting theposition of the component feeding unit or the loading position of theparts cassettes on the component feeding unit in a direction forcorrecting the displacement. Also, if it is detected from thedisplacement amount data that one specific type of electronic componentis picked up in a displaced position, such displacement can be correctedby adjusting the component feeding position to the component pick-upposition from the parts cassette which feeds this type of component.

[0018] Also, in order to achieve the above object, the device formounting an electronic component in which a plurality of parts cassettesrespectively accommodating different types of electronic components aremoved by a component feeding unit to a component pick-up position in amounting order for feeding electronic components, and a plurality ofcomponent suction nozzles are successively moved along a circular trackfrom the component pick-up position, where the component suction nozzlepicks up the electronic component, to a posture recognizing position,where the posture of the electronic component held with the componentsuction nozzle is detected, based on which the position and angle of theelectronic component in relation to a predetermined position on acircuit substrate are corrected, and further to a component mountingposition, where the picked-up electronic component is mounted on thepredetermined position on the circuit substrate, according to thepresent invention, comprises: a displacement amount data processingmeans for obtaining data on an amount of displacement of the electroniccomponent from a prescribed holding position of the suction nozzlecorresponding to each of the parts cassettes based on posturerecognition results detected at the posture recognizing position, and adrive means for moving the component feeding unit or the parts cassetteso as to adjust the component feeding position to the component pick-upposition in a direction for correcting the amount of displacement of theelectronic component which is obtained from the displacement amountdata.

[0019] With the above described structure, from the data on the postureof the component held by the nozzle with respect to all the electroniccomponents detected at the posture recognizing position, the data ondisplacement amount of the component per each parts cassettes can beobtained by means of the displacement data processing means, whereforethe tendency of displacement in the component feeding position withrespect to the pick-up position of the component suction nozzle can berecognized. Specifically, if it is found that all of the electroniccomponents are displaced in the same direction, it is determined thatthe position of the component feeding unit or the parts cassettes in itsentirety is inappropriate in relation to the component pick-up position,whereupon the component feeding unit or the entire group of partscassettes is moved in a direction for correcting the displacement basedon the obtained amount of displacement. Also, if it is found that only aspecific type of electronic components are always picked up in adisplaced position, it is determined that the feeding position of theparts cassette which feeds this type of electronic component isinappropriate, whereupon the feeding position of the parts cassettewhich feeds the component is adjusted.

BRIEF DESCRIPTION OF THE DRAWINGS

[0020]FIG. 1 is a perspective view showing an essential structure of acomponent mounting device according to one embodiment of the presentinvention;

[0021]FIG. 2 is a plan view typically showing a positional relationshipof the component mounting device of FIG. 1;

[0022]FIG. 3 is a typical view showing a component picked up by acomponent suction nozzle in a displaced state;

[0023]FIG. 4 is a typical view showing an essential structure of aconventional electronic component mounting apparatus;

[0024]FIG. 5 is a diagram for explaining a state of component which isbeing mounted to a mounting position on the circuit substrate;

[0025]FIG. 6 is a diagram for explaining a state of component which isbeing mounted to a mounting position on the circuit substrate with highmounting density; and

[0026]FIG. 7 is a flow chart showing an example of control of the devicein one embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0027] Preferred embodiments of the present invention will be describedbelow with reference to the accompanying drawings for betterunderstanding of the present invention.

[0028]FIG. 1 shows a main structure of the component mounting deviceaccording to one embodiment of the present invention. The devicecomprises a suction nozzle unit 1 with a plurality of suction nozzles 11(component suction nozzle) which are successively moved around on acircular track, a component feeding unit 2 with a multiplicity of partscassettes 3, a recognition camera 4 for recognizing the picked-upposture of the electronic component held by the suction nozzle 11, andan X-Y table 6 for supporting and transferring a circuit substrate 5loaded from a loader 8 such as to bring a mounting position of theelectronic component toward just below the suction nozzle 11.

[0029]FIG. 2 is a plan view typically showing the disposition of theabove described structure. The suction nozzle unit 1 has a rotarystructure in which ten suction nozzles 11 attached on its head la aremoved in a direction shown by the arrow in the figure with a fixed stepon a circle. Each moved position is denoted at encircled numerals 1 to10. The component feeding unit 2 carries and transfers the plurality ofparts cassettes 3 in the Y-axis direction as shown, in such a way thatthe parts cassette 3 accommodating the desired type of components isbrought to a component feeding position which is under the componentpick-up position A (moved position denoted at encircled numeral S) ofthe suction nozzle unit 1 in the order of mounting onto the circuitsubstrate 5. The suction nozzle unit 1 picks up by suction an electroniccomponent from the parts cassette 3 which has been transferred to thecomponent feeding position with the suction nozzle 11 located at thecomponent pick-up position A. The suction nozzle 11 which has picked upthe electronic component is moved by rotation to the posture recognizingposition B (moved position denoted at encircled numeral 7) above therecognizing camera 4, where the attitude of the electronic componentheld by the nozzle is recognized. Based on the data obtained by thisimage recognition using the camera 4, the suction nozzle 11 corrects thedisplacement of the component in a rotating direction by rotatingmovement at the posture correcting position C (moved position denoted atencircled numeral 9).

[0030] Meanwhile, as shown in FIG. 1, the circuit substrate 5 is loadedfrom the loader 8 onto the X-Y table 6, and moved with free movements inthe X- and Y- directions of the X-Y table 6 such that the mountingposition of the electronic component is brought under the componentmounting position D (moved position denoted at encircled numeral 10) ofthe suction nozzle unit 1. Also, the displacement in the position of theelectronic component held by the nozzle in X- and Y- directions iscorrected with mounting position correcting action of the X-Y table 6with its movements in X- and Y- directions. Accordingly, even in thecase where the center of the nozzle and that of the component are not inregister with each other, the displacement in rotating direction iscorrected with the rotation of the suction nozzle 11, and thedisplacement in X- and Y- directions is corrected by the movements ofthe X-Y table 6, whereby the suction nozzle 11 which has moved to thecomponent mounting position D is able to mount the electronic component5 onto a predetermined mounting position by being lowered. These actionsare repeated until all the necessary electronic components are mountedon the circuit substrate 5, after which the substrate 5 is carried awayby an unloader 9 to the outside of the apparatus.

[0031] It is possible to carry out accurate mounting operation thanks tothe position correcting actions as described above, even in the casewhere the electronic component is held with the suction nozzle 11 in adisplaced posture. However, in a circuit substrate 5 with high mountingdensity as previously shown in FIG. 6, there still remains a risk thatthe suction nozzle 11 will touch a previously mounted electroniccomponent, if the center positions of the suction nozzle 11 and theelectronic component are not in register with each other. Also, if thereare any components which the nozzle failed to mount on the circuitsubstrate 5 due to failure in picking up action, the device performs itsautomatic recovery action for mounting the component which has not beenmounted after the completion of mounting operation of all the othercomponents. In such case, the component has to be mounted betweenadjacent components which have previously been mounted or next to acomponent of greater height, wherefore it is necessary to pick up theelectronic component at a predetermined position of the suction nozzle11. Furthermore, if the electronic component is held in an appropriateposition of the suction nozzle 11, the X-Y table 6 needs to movecorrespondingly less for correction of the displacement, whereby it ispossible to enhance production efficiency.

[0032] Therefore, in the component mounting device of the presentinvention, there is provided a means for adjusting the pick-up positionof the electronic component by the suction nozzle 11. The amount ofdisplacement of the electronic component from a predetermined positionof the suction nozzle 11 can be recognized by image recognition usingthe posture recognition camera 4 disposed under the posture recognizingposition B, which is then inputted in a displacement detecting section(displacement amount data processing means) 7. As shown in FIG. 3, theamount of displacement x in the X-axis direction and the amount ofdisplacement y in the Y-axis direction are measured with respect to thecenter of the suction nozzle 11 and that of the electronic component 12,and resultant data are stored in this displacement detecting section 7for each type of electronic components. Since various different types ofcomponents are accommodated in respective parts cassettes 3, by storingdata on displacement amount for each type of electronic components,displacement of the component feeding position with respect to thecomponent pick-up position A per each parts cassette 3 can be detected.In addition to the data on displacement in X- and Y- directions, it iseven more preferable if an amount of displacement of the component 12 ina rotating direction is also detected, and resultant data are stored.

[0033] Displacement of the electronic component from a predeterminedposition of the suction nozzle 11 is caused sporadically when beingpicked up by the nozzle 11. On the other hand, if the position of thesuction nozzle 11 at the component pick-up position A and the positionof the parts cassettes 3 are not correspondent to each other, it is alsothe cause of displacement of the component. Consequently, data can beobtained as to whether the displacement is found only in one specifictype of electronic component or in all types of the electronic componentby storing data of displacement amount for each of the different typesof electronic components.

[0034] If displacement is found only in a specific type of electroniccomponents, it can be determined that the component feeding position ofthe parts cassette 3 which feeds this type of component isinappropriate. Accordingly, adjustment is made so that components areaccurately fed to the component feeding position A from the partscassette 3 in question. Also, if it is found that all of the electroniccomponents are picked up in a displaced posture, it can be determinedthat the disposition of the component feeding unit 2 or the loadingposition of the entire group of the parts cassettes 3 on the componentfeeding unit 2 is displaced, and adjustment is made accordingly.

[0035] Such adjustment can be accomplished manually at the time when itis detected at the displacement detecting section 7 that the amount ofdisplacement is beyond a permissible range, but it is also possible toconstruct such that the component feeding unit 2 is provided with adrive mechanism 10 (drive means) as shown in FIG. 2 for slightly movingthe component feeding unit 2 in X- and Y- directions by driving signalsoutputted from the displacement detecting section 7 which commanddirections for correcting the displacement. It is similarly effective ifit is constructed such that the loading position of the parts cassettes3 is moved for such displacement correction.

[0036] It is also possible to provide each of the parts cassettes 3 witha mechanism for moving in a minute amount in the X-axis direction and toconstruct such that the movement of each parts cassette 3 (in the Y-axisdirection) imparted by the component feeding unit 2 toward the componentfeeding position A is adjusted based on the amount of displacement,whereby displacement of a specific electronic component can be alsocorrected.

[0037] The component mounting device of the above described constructionis constituted such that in case the amount of displacement of thecomponent is larger than a prescribed value, it is informed that theparts cassette 3 from which the component being held by the suctionnozzle 11 is in abnormal condition, and the action of mounting thatcomponent is stopped. Such mounting action is performed as will bedescribed below.

[0038] At the component pick-up position A, the component loaded on theparts cassette 3 is picked up by the suction nozzle 11 and istransferred to the next position or the posture recognizing position Bwith the rotation of the head la of the suction nozzle unit 1. At theposture recognizing position B where the electrode or the shape of thepicked-up component is recognized, an amount of displacement between acentral position of the nozzle and that of the component is measured andthe data is saved in a displacement detecting section (datameasurement/process unit) 7. The displacement detecting section 7controls the device to pause so that the component 12 currently held bythe suction nozzle 11 is not to be mounted, or pauses the device andsimultaneously generates a warning sign, in order to preventinterference between a component 12 a which has previously been mountedand the suction nozzle 11, when the measured amount of displacement p,i.e., the difference q between the outer edge of the component 12 andthat of the suction nozzle 11, is equal to or larger than the space rbetween two adjacent components (q>r). At the same time, a warning signindicating abnormality of the parts cassette 3 from which the currentlyheld component 12 has been fed is generated.

[0039] An alarm indicator 21 shown in FIG. 2 is constructed such that incase the displacement amount of the picked-up component 12 is such aswould cause interference between a previously mounted component 12 a andthe component suction nozzle 11, an alarm indicating portion isilluminated or lighted on and off on receiving information from thedisplacement detecting section (data measurement/processing unit) 7, andthat information (for example, numerals identifying each parts cassette)which specifies the parts cassette 3 from which the component 12currently held by the component suction nozzle 11 has been fed isdisplayed. Such warning sign may be also generated by a sound effect. Itis also possible to construct such that a warning lamp is individuallyprovided to each of the parts cassettes 3, and when one of the partscassettes 3 is detected to be in abnormal condition, the warning lamp ofthe abnormal parts cassette 3 is illuminated.

[0040]FIG. 7 is a control flow chart of a control unit (not shown) fordetermining whether the component mounting operation should be performedor stopped based on the amount of displacement in position of thecomponent detected by the displacement detecting section (datameasurement/processing unit ) 7 and the information on the shape andheight of each type of electronic component which is previously stored.

[0041] First, at step S1, it is determined whether the height h of thecomponent 12 which is going to be mounted is larger than the height H ofthe adjacent component 12 a which has previously been mounted (see FIG.6). If h is more than H (h>H), the procedure goes on to step S4 and thecomponent mounting operation is performed, since there is no risk thatthe component suction nozzle 11 and the component 12 a interfere witheach other. If H is equal to or greater than h (h≦H), the procedureproceeds to step S2, where it is determined whether the distance qbetween the outer edge of the component 12 which is going to be mountedand the outer edge of the component suction nozzle 11 is smaller thanthe space r between adjacent components. If q is smaller than r (q<r),the procedure goes on to step S4 and the component mounting operation isperformed, since there is no risk that the component suction nozzle 11and the component 12 a interfere with each other. If q is equal to orlarger than r (q≧r), the component suction nozzle 11 and the previouslymounted component 12 a will interfere with each other, so the procedureproceeds to step S3 where the component mounting operation is stoppedand a warning sign is generated.

[0042] Although the above embodiment has been described in relation to acase in which the apparatus is in operation, various modifications areof course possible. For example, in a preparation step prior to actualmanufacturing operation, components accommodated in the parts cassetteswhich are installed in a component feeding unit may be picked up fromall of the parts cassettes with suction nozzles and the measurement withrespect to center positions of the nozzles and the components may bemade, so that abnormality of each nozzle and parts cassette can bedetected based on that data. In such a case, if there are defectivenozzles or parts cassettes, they can be identified prior to actualproduction, whereby mounting errors can be prevented.

[0043] Also, although the above described embodiment has been describedin relation to a component mounting device of rotary structure providedwith a suction nozzle unit, the present invention is not limited to thisand may be also adopted to a device of another type in which, forexample, the suction nozzle moves in X- and Y- directions. Furthermore,the parts cassettes as have been described in the above embodiment arenot limited to a tape-like component assembly but may be, for example, astocker type component feeder.

[0044] While a preferred embodiment of the invention has been describedusing specific terms, such description is for illustrative purposesonly, and it is to be understood that changes and variations may be madewithout departing from the spirit or scope of the following claims.

What is claimed is:
 1. A component mounting device in which anelectronic component is mounted on a circuit substrate, comprising: ameans for measuring an amount of displacement between a center positionof a component suction nozzle and a center position of the componentheld by the component suction nozzle with respect to each of thecomponents fed from all parts cassettes set in a component feeding unitduring the component mounting device is in operation, informing that aparticular parts cassette from which the component has been fed is inabnormal condition when the amount of displacement is larger than apredetermined value, and for stopping the action of mounting thecomponent.
 2. A component mounting device in which an electroniccomponent is mounted on a circuit substrate, comprising: a means whichmeasures an amount of displacement between a center position of acomponent suction nozzle and a center position of a component held bythe component suction nozzle, and detects and informs that a particularcomponent suction nozzle or parts cassette from which the component hasbeen fed is in abnormal condition based on resultant data ofmeasurement, wherein the component is respectively picked up by thecomponent suction nozzle from all of the parts cassettes set in acomponent feeding unit and measurement of the displacement amount of thecomponent is effected in a preparatory step before commencement ofactual production.
 3. A component mounting method wherein a componentwhich is fed from a multiplicity of parts cassettes set in a componentfeeding unit is picked up successively by a component suction nozzle ata component pick-up position of the parts cassettes and is in successionmounted onto a circuit substrate, comprising the steps of: measuring anamount of displacement of the component with respect to the componentsuction nozzle; informing that a parts cassette from which the componentbeing held by the component suction nozzle is in abnormal condition whenthe measured amount of displacement of the component is larger than apredetermined value based on resultant data of measurement; and stoppinga mounting operation for mounting the component of which parts cassettehas been detected to be in abnormal condition.
 4. The component mountingmethod according to claim 3 in which the amount of displacement of thecomponent is obtained by measuring a distance between a center positionof the component suction nozzle and a center position of the componentwhich is held by the component suction nozzle.
 5. The component mountingmethod according to claim 3 in which abnormality of the parts cassetteis informed and the mounting operation is stopped when the amount ofdisplacement of the component is such as would cause the componentsuction nozzle to interfere with a component which has previously beenmounted.
 6. A component mounting method wherein a component which is fedfrom a multiplicity of parts cassettes set in a component feeding unitis picked up successively by a component suction nozzle at a componentpick-up position and is in succession mounted onto a circuit substrate,comprising the steps of: in a preparatory step before an actualmanufacturing operation is started, picking up respective componentsfrom all of the parts cassettes set in the component feeding unit,measuring an amount of displacement of each of the components withrespect to the component suction nozzle; detecting and informing that anozzle or a parts cassette is in abnormal condition.
 7. The componentmounting method according to claim 6 in which the amount of displacementof the component is obtained by measuring a distance between a centerposition of the component suction nozzle and a center position of thecomponent which is held by the component suction nozzle.
 8. A componentmounting method wherein a component which is fed from a multiplicity ofparts cassettes set in a component feeding unit is picked upsuccessively by a component suction nozzle at a component pick-upposition of the parts cassettes and is in succession mounted onto acircuit substrate, comprising the steps of: measuring an amount ofdisplacement of the component with respect to the component suctionnozzle; and adjusting the component pick-up position of the partscassette which requires position adjustment based on resultant data ofmeasurement.
 9. A method of mounting an electronic component in which aplurality of parts cassettes respectively accommodating different typesof electronic components are moved by a component feeding unit to acomponent pick-up position in a mounting order for feeding electroniccomponents, and a plurality of component suction nozzles aresuccessively moved along a circular track from the component pick-upposition, where the component suction nozzle picks up the electroniccomponent, to a posture recognizing position, where the posture of theelectronic component held with the component suction nozzle is detected,based on which the position and angle of the electronic component inrelation to a predetermined position on a circuit substrate arecorrected, and further to a component mounting position, where thepicked-up electronic component is mounted on the predetermined positionon the circuit substrate, comprising the steps of: obtaining data on anamount of displacement of the component from a prescribed holdingposition of the component suction nozzle corresponding to each of theparts cassettes based on posture recognition results detected at theposture recognizing position; and adjusting a feeding position of theelectronic component to the component pick-up position based on thisdisplacement amount data.
 10. The method of mounting an electroniccomponent according to claim 9 , in which the position of the componentfeeding unit or the placing position of the parts cassettes onto thecomponent feeding unit is adjusted based on the displacement amountdata.
 11. The method of mounting an electronic component according toclaim 9 , in which the component feeding position from each of the partscassettes toward the component pick-up position is adjusted based on thedisplacement amount data.
 12. A device for mounting an electroniccomponent in which a plurality of parts cassettes respectivelyaccommodating different types of electronic components are moved by acomponent feeding unit to a component pick-up position in a mountingorder for feeding electronic components, and a plurality of componentsuction nozzles are successively moved along a circular track from thecomponent pick-up position, where the component suction nozzle picks upthe electronic component, to a posture recognizing position, where theposture of the electronic component held with the component suctionnozzle is detected, based on which the position and angle of theelectronic component in relation to a predetermined position on acircuit substrate are corrected, and further to a component mountingposition, where the picked-up electronic component is mounted on thepredetermined position on the circuit substrate, comprising: adisplacement amount data processing means for obtaining data on anamount of displacement of the electronic component from a prescribedholding position of the suction nozzle corresponding to each of theparts cassettes based on posture recognition results detected at theposture recognizing position, and a drive means for moving the componentfeeding unit or the parts cassette so as to adjust the component feedingposition to the component pick-up position in a direction for correctingthe amount of displacement of the electronic component which is obtainedfrom the displacement amount data.